Sustainable Electronics Manufacturing 2023-2033 - IDTechEx

1. EXECUTIVE SUMMARY 1.1. Sustainability is of growing importance in the electronics industry 1.2. Europe aiming to double global market share of integrated circuits 1.3. International supply chain comes with heavy emissions burden 1.4. Large share of renewables in developed countries could reduce 'reshoring' cost premium 1.5. Digital manufacturing can facilitate sustainable electronics manufacturing 1.6. Recycling/reuse initiatives are a strong opportunity 1.7. One third of emissions from the electronics industry are produced by integrated circuits 1.8. Market status of FR4 alternatives 1.9. Sustainability benefits of PCB manufacturing with 'print and plate' 1.10. Comparing component attachment types 1.11. Market readiness of different solders and ECAs 1.12. Etchant produces largest amount of hazardous waste in PCB manufacturing 1.13. Ingot sawing costs industry billions in lost silicon and wasted energy 1.14. Gallium nitride is more sustainable and lower cost than silicon for ICs 1.15. PragmatIC developing thin film alternatives to silicon with 1000x lower embedded energy 1.16. Dry (plasma) etching could provide long-term savings and reduce toxic waste in IC manufacturing 1.17. Physical vapour deposition may be the best choice for IC copper interconnects 1.18. Water conservation increasing among major players 1.19. Samsung operating global take-back schemes 1.20. Key takeaways (i) 1.21. Key takeaways (ii) 1.22. Key takeaways (iii) 2. INTRODUCTION 2.1. The electronics industry today 2.2. Sustainability is of growing importance in the electronics industry 2.3. EU aims to cut emissions by >55 % by 2030 2.4. 'Fit for 55' expected to drive forward a sustainable electronics industry within the EU 2.5. Global electronics industry may follow suit 2.6. Large share of renewables could benefit low-cost manufacturing 2.7. Ubiquitous electronics require sustainable solutions 2.8. Engaging with sustainability promotes new opportunities in the electronics industry 2.9. Conventional electronics manufacturing poses obstacles to sustainability challenge 2.10. Sustainability regulations around the world impacting the electronic industry 2.11. Carbon prices are expected to rise 2.12. The SEC is cracking down on greenwashing 2.13. Manufacturing strategies to increase speed and reduce embedded energy 2.14. Digital manufacturing can facilitate sustainable electronics manufacturing 2.15. Recycling/reuse initiatives for electronics gain traction 2.16. International supply chain comes with heavy emissions burden 2.17. Traditional PCBs: Emissions reductions enabled by on-site prototyping 2.18. Report structure (i): PCB value chain 2.19. Report structure (ii): Integrated circuits (ICs) value chain 3. MARKET FORECASTS 3.1. Forecasting methodology 3.2. PCB substrate production 3.3. PCB substrate revenue 3.4. Patterning and metallization: Rigid PCBs 3.5. Patterning and metallization: Flexible PCBs 3.6. Component attachment materials: Rigid PCBs 3.7. Component attachment materials: Flexible PCBs 3.8. Materials for integrated circuits (i) 3.9. Production of integrated circuits (ii) 4. EMERGING SUSTAINABLE MANUFACTURING METHODS OF PRINTED CIRCUIT BOARDS 4.1. PCB manufacturing: Chapter structure 4.1.1. Introduction: History of traditional PCBs 4.1.2. Conventional PCB manufacturing 4.1.3. Manufacturing of PCBs concentrated in APAC 4.1.4. Key areas for sustainability within PCBs 4.1.5. Sustainable materials for PCB manufacturing 4.2. PCB Design Options 4.2.1. Introduction: Design options for PCBs 4.2.2. Double-sided and multi-layered PCBs allow extra complexity and reduce board size 4.2.3. Flexible PCBs require new innovation 4.2.4. Moving away from rigid PCBs will enable new applications 4.2.5. An introduction to in-mold electronics 4.2.6. IME manufacturing process flow 4.2.7. Motivation and challenges for IME 4.2.8. How sustainable is IME? 4.2.9. IME can reduce plastic usage by more than 50 % 4.2.10. Key takeaways: PCB design options 4.3. Substrate Choices 4.3.1. Introduction: Substrate choices 4.3.2. FR4 uses toxic halogenated substances 4.3.3. Legislation on halogenated substances is becoming more restrictive 4.3.4. Halogens pose significant health and safety threat as electronics become smaller 4.3.5. Halogen-free FR4 presents numerous advantages 4.3.6. Household names adopting low or halogen-free technology 4.3.7. HP working with Clariant to develop halogen-free electronics from recycled materials 4.3.8. SWOT Analysis: Halogen-free FR4 4.3.9. Bio-based printed circuit boards 4.3.10. Switching to bio-based PCBs involves new optimization 4.3.11. Challenges facing bio-plastics 4.3.12. Polyimide is the leading non-FR4 alternative 4.3.13. Application areas for flexible (bio) polyimide PCBs 4.3.14. (Bio)polyimide could be the material of the future for flexible electronics 4.3.15. PET is much more cost-effective than PI 4.3.16. Jiva has developed the first fully recyclable bio-based PCB 4.3.17. Microsoft working on sustainable PCBs 4.3.18. Dell's Concept Luna laptop using flax-based PCBs 4.3.19. Paper-based PCBs could be an environmentally friendly and low-cost solution 4.3.20. Arjowiggins printing circuits onto paper 4.3.21. SWOT Analysis: Bio-based materials 4.3.22. Market status of FR4 alternatives 4.3.23. Innovation opportunities for FR4 alternatives 4.3.24. Sustainability index: PCB substrates 4.3.25. Key takeaways: FR4 alternatives 4.4. Patterning and Metallization 4.4.1. Introduction: Patterning and metallisation 4.4.2. Conventional metallization is wasteful and harmful 4.4.3. Common etchants pose environmental hazards 4.4.4. Etchant regeneration could make wet etching more sustainable 4.4.5. Dry phase patterning removes sustainable hurdles associated with wet etching 4.4.6. Print-and-plate could revolutionize PCB manufacturing 4.4.7. Sustainability benefits of print-and-plate 4.4.8. Print-and-plate for in-mold printed circuits 4.4.9. Laser induced forward transfer (LIFT): Combining the best of inkjet and laser direct structuring 4.4.10. Operating mechanism of laser induced forward transfer (LIFT) 4.4.11. Target applications for laser induced forward transfer 4.4.12. Copper inks more sustainable and cost-effective than silver 4.4.13. Copper inks with in-situ oxidation prevention 4.4.14. Formaldehyde alternative for green electroless plating 4.4.15. Innovation opportunities for patterning and metallisation processes 4.4.16. Sustainability index: Patterning and Metallisation Processes 4.4.17. Sustainability index: Patterning and Metallisation Materials 4.4.18. Key takeaways: Patterning and metallization 4.5. Component Attachment Materials and Processes 4.5.1. Introduction: Component attachment materials 4.5.2. Comparing component attachment types 4.5.3. Introduction: Limitations of conventional lead-free solder 4.5.4. Low-temperature soldering and adhesives reduces energy and enables new technology 4.5.5. Low temperature solder alloys 4.5.6. Low temperature solder enables thermally fragile substrates 4.5.7. Substrate compatibility with existing infrastructure 4.5.8. Low temperature solder could perform as well as conventional solder 4.5.9. Low temperature solder may increase cost per PCB by extending reflow times 4.5.10. SAFI-Tech's innovative supercooled liquid solder 4.5.11. SWOT Analysis: Low temperature solder 4.5.12. Electrically conductive adhesives - a component attachment material for fully flexible electronics? 4.5.13. Key ECA innovations reduce silver content 4.5.14. ECAs in in-mold electronics (IME) 4.5.15. ECA curing may be more energy efficient than low temperature solder reflow 4.5.16. SWOT Analysis: ECAs 4.5.17. Market readiness of different solders and ECAs 4.5.18. ECAs vs low temperature solder 4.5.19. Innovation opportunities: Component attachment materials 4.5.20. Sustainability index: Component attachment materials 4.5.21. Key takeaways: Component attachment materials 4.5.22. Introduction: Curing and reflow processes 4.5.23. Thermal processing can be slow and time consuming 4.5.24. UV curing of ECAs could lower heat 4.5.25. Photonic sintering/curing could enable cheaper production and reduce factory size 4.5.26. Near-infrared radiation can dry in seconds 4.5.27. Market readiness of component attachment processes 4.5.28. Sustainability index: Component attachment processes 4.5.29. Key takeaways: Component attachment processes 4.6. End of Life - Disposal and Recycling 4.6.1. Introduction: End of life 4.6.2. Etchant produces largest amount of hazardous waste 4.6.3. Recovery of copper oxide from waste water slurry is effective but inefficient 4.6.4. Print-and-plate could save PCB industry 200 million litres of water annually 4.6.5. VTT's life cycle assessment of in-mold electronics 4.6.6. IME vs reference component kg CO&#8322 equivalent (single IME): Cradle to gate 4.6.7. IME vs reference component kg CO&#8322 equivalent (10,000 IME panels): Cradle to grave 4.6.8. Summary of VTT's life cycle assessment 4.6.9. Key takeaways: End of life 5. SUSTAINABLE INNOVATION WITHIN INTEGRATED CIRCUITS 5.1. IC manufacturing: Chapter structure 5.1.1. Conventional integrated circuit manufacturing 5.1.2. Key areas for sustainability within IC manufacturing 5.2. Wafer Production 5.2.1. Introduction to wafer production for ICs 5.2.2. Conventional silicon wafer production 5.2.3. Ingot sawing costs industry billions in lost silicon and wasted energy 5.2.4. Innovation within the silicon PV industry could benefit integrated circuits 5.2.5. Gallium nitride is more sustainable and lower cost than silicon 5.2.6. Gallium nitride not susceptible to chip shortage concerns 5.2.7. SWOT analysis: Gallium nitride ICs 5.2.8. PragmatIC developing thin film alternatives to silicon with 1000x lower embedded energy 5.2.9. SWOT analysis: PragmatIC's flexible ICs 5.2.10. Fully printed organic ICs are in early stage development 5.2.11. SWOT analysis: Organic ICs 5.2.12. Sustainability index: Wafer production 5.2.13. Key takeaways: Wafer manufacturing 5.3. Oxidation 5.3.1. Introduction to oxidation 5.3.2. Recycling acid etchants reduces highly toxic waste and increases supply chain security 5.3.3. Thinner gate oxides reduce time and energy consumption during oxidation 5.3.4. Metal oxides could replace silicon oxide in the future 5.3.5. Solution-based hafnium oxide could reduce fabrication time 5.3.6. Market readiness of oxide options 5.3.7. Sustainability index: Oxidation 5.3.8. Key takeaways: Oxidation 5.4. Patterning and Surface Doping 5.4.1. Introduction: Patterning and surface doping 5.4.2. Wet chemical etching is the most conventional method but wasteful 5.4.3. Dry (plasma) etching could provide long-term savings and reduce toxic waste 5.4.4. Nano OPS' 'fab in a tool' could cut IC costs by 2 orders of magnitude 5.4.5. Surface doping - room for improvement? 5.4.6. Sustainability index: Patterning 5.4.7. Key takeaways: Patterning and doping 5.5. Metallization 5.5.1. Introduction: Metallization 5.5.2. The return of metal gates may increase costs 5.5.3. Due diligence restrictions on tantalum sourcing imposed by EU policy 5.5.4. Printed metal gates for organic thin film transistors 5.5.5. Physical vapour deposition may be the best choice for copper interconnects 5.5.6. Sustainability index: Metallization 5.5.7. Key takeaways: Metallization 5.6. End of Life 5.6.1. Introduction: End of life 5.6.2. One third of emissions from the electronics industry are produced by integrated circuits 5.6.3. Increasing renewable energy can result in substantial emissions reductions 5.6.4. Early testing minimizes waste 5.6.5. Water conservation increasing among major players 5.6.6. Samsung operating global take-back schemes 5.6.7. Key takeaways: End of life 6. COMPANY PROFILES 6.1. Alpha 6.2. Altana 6.3. CondAlign 6.4. DP Patterning 6.5. Elephantech 6.6. imec 6.7. Intel 6.8. IOTech 6.9. Kieron 6.10. NanoOPS 6.11. PragmatIC 6.12. SAFI-Tech 6.13. Samsung 6.14. Sunray Scientific 6.15. TactoTek 6.16. TSMC 6.17. VTT

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